We are delighted to announce two programs for student participation at ACML 2022 – student scholarship and mentorship roundtable. The purpose of these two programs is to provide financial support for conference participation, and research guidance to aspiring students at ACML 2022, respectively.

IMPORTANT: To be eligible for these programs, you must be registered as a full-time student at a higher education institute (e.g. a University).

Student Scholarship Program: This program is intended to enable and financially support students to attend the conference in-person or virtually, as the case may be.

  • For students attending the conference in-person, the scholarship amount is upto INR 10,000 (approx 125 USD). If you receive a scholarship, you need to register for the conference. The scholarship amount will be provided during the conference on participation.
  • For student scholarship awardees attending the conference in online mode, an amount of INR 1500 (approx 20 USD), equivalent to early bird registration fees under the "students" category and the "secondary authors/other attendees" subcategory will be reimbursed during/after the conference.
Mentorship Roundtable: The program is intended for upper-level undergraduate, and graduate students at all levels and postdoctoral researchers with focused discussions on ML research and career advice. These sessions are expected to include general how-to sessions on ML research, as well as one-on-one interactions with successful and renowned mentors from academia and industry.

To apply for either or both of the above programs, complete the student application form at https://forms.gle/miCyG796UYYDpGfM9. As part of this application, you will need to provide proof of your current student status.

The deadline for submitting your application is 07 Nov 2022, AoE.

The applications will go through a selection process, and the organizers hold the right to select the candidates. We expect to notify the applicants soon after the deadline (most likely within a week).

We look forward to seeing applications from many of you and also seeing many of you at the conference.